隨著現(xiàn)代電子產(chǎn)品的復(fù)雜化,對(duì)于保護(hù)組件運(yùn)用的要求也日益提高,如保護(hù)的全面性、有限的預(yù)留空間等,隨著這些要求的提出,保護(hù)組件界掀起了一場(chǎng)組合封裝的熱潮,如上面提到過(guò)流過(guò)溫保護(hù)也算組合封裝的一種,但過(guò)流過(guò)壓保護(hù)組合封裝產(chǎn)品目前大多數(shù)還處在研發(fā)階段,還沒(méi)有成熟的商業(yè)化產(chǎn)品面市。
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